PCB main types of substrate material introduction, differences and general models
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Author:Symwill Tech
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Release time:2020-04-22
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Symwill will introduce four main PCB substrates on the market, including the Paper-based circuit board, Epoxy glass fiber circuit board, Composite substrate circuit board and Special substrate circuit board, their difference and their commonly used models.
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We would like to share the four main PCB substrates on the market, hope it could help you to understand better.
1. Paper-based circuit board, the base material used is fiber paper as a reinforcing material, dipped in a phenolic solution for dry bath processing, and coated with electrolytic copper foil coated with high humidity and high pressure; In the ASM / NEMA standard, the main varieties are FR-1, FR-2, FR-3, XPC, XXXPC, etc .More than 85% of the global paper-based paper board market is in Asia. The most commonly used and the production volume is FR-1 and XPC circuit boards;
2. Epoxy glass fiber circuit board. The substrate of this type of circuit board is epoxy or modified epoxy resin as an adhesive, and glass fiber cloth is used as a reinforcing material. In the ASM / NEMA standard, there are four models: G-10 (not flame retardant), FR-4 (94V0 flame retardant), G-11 (94HB retained thermal strength, not flame retardant), FR-5 (reserved thermal Strength, resistance 94V0), in fact, Non-flame retardant products are used less and less, FR-4 occupy the most of the market;
3. Composite substrate circuit board, the fabric and core material used in this type of circuit board are composed of different reinforcing materials. The base materials of copper clad laminates used are mainly CEM (composite epoxy material) series, among which CEM-1 and CEM-3 are the most representative.CEM-1 base material is glass fiber cloth, core material is paper, resin is epoxy, flame retardant; CEM-3 base material is glass fiber cloth, core material is glass fiber paper, resin is epoxy, flame retardant. The basic characteristics of the composite substrate circuit board are equivalent to FR-4, but the cost is lower, the mechanical processing performance is better than FR-4, Flame retardant level: 94V0 level, flame retardant.
4. Special substrate circuit board, metal substrate (aluminum base, copper base, iron base or Invar steel), ceramic base material, according to its characteristics, use can be made into metal (ceramic) base single, double, multilayer circuit board Metal core circuit board. Aluminum substrate models are: 106-5052-6161.
Each substrate has different manufacturers and models. The following lists Symwill PCB Tech used substrate models:
1. HDI PCB material: RCC(65T&100T) LDPP(IT-180A 1037&1086) Normal PP 106&1080.
2. Normal FR-4: Shengyi S1141 ( not recommend it to lead free assembly process).
3. Normal Tg FR-4 (Halogen free): Shengyi S1155.
4. High Tg FR-4 (Halogen free): Shengyi S1165.
5. High CT1: Shengyi S1600
6. High Tg FR-4: FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR, IT180A, IT-150DA, N4000-13, N4000-13SI, N4000-13EP SI, Megtron 4,
Megtron 6 (Panasonic), EM-827(Elite), GA-170(Grace Electron),NP-180(Nanya), TU-752, TU-662(Taiwu Union), MC-BE-67G(H), MCL-E-679(W), MCL-E-679F(J)(Hitachi), VT-47(Ventec).
7. Ceramic powder filled high-frequency materials: Rogers4350, Rogers4003, 25FR, 25N, PTFE Laminates:Rogers series Taconic series Arlon series Nelco series Taizhou
Wangling, F4BK series TP series etc.
